製程能力
SMT
Support 0201,0402 components
Special part shapes that can be accommodated include BGA, Micro BGA, SOIC, PLCC and QFP types of packaged assemblies
Special part shapes that can be accommodated include BGA, Micro BGA, SOIC, PLCC and QFP types of packaged assemblies
COB DIE bonder
Support Die Size during 0.9mm~21mm(36~826 mil)
Support Substrate Size :
L:120mm~250mm
W:13.5~90mm
T:0.1mm~1.7mm
Support Chip Placement: Accuracy X/Y ±40um
Accuracy θ: 0.5mm
Pitch 5mm~90mm
Die Tilt ＞1 Mil
Support Substrate Size :
L:120mm~250mm
W:13.5~90mm
T:0.1mm~1.7mm
Support Chip Placement: Accuracy X/Y ±40um
Accuracy θ: 0.5mm
Pitch 5mm~90mm
Die Tilt ＞1 Mil
COB Wire Bonder
Support Stack die or Multi Die
Support Ultra Fine Pitch (35um)
Support Auto Load/Unload
Support 0.6mil~2 mil gold wire
Max /Min wire length 7.6mm/0.1mm
Support Ultra Fine Pitch (35um)
Support Auto Load/Unload
Support 0.6mil~2 mil gold wire
Max /Min wire length 7.6mm/0.1mm