SMT

Support 0201,0402 components Special part shapes that can be accommodated include BGA, Micro BGA, SOIC, PLCC and QFP types of packaged assemblies

COB Process Line

Support D/B W/B and Molding process of substrate material

Substrate Manufactur

http://www.tripod-tech.com/

SiP/MCM process OEM

Support SMT/CSP/COB and Assembly process