A. Develop process for high-speed, high-level products.
B. Develop process for thin TFT-LCD backplane.
C. Complete development of build-up buried/bind via process for color display mobile phones.
D. Successfully introduce high aspect ratio via hole technology for manufacturing.
E. Effectively produce high-end server motherboards with pin-lamination technology.?
F. Develop halogen-free materials to support processes with lead-free solder.
G. Introduce multi-pattern surface treatment to support assembly technology and improve reliability of downstream assembly facilities.